Premium zinc oxide based thermal compound for optimal thermal performance to improve heat transfer and lower temperatures.
Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste.
XTM50’s low viscosity allows it to easily fill microscopic abrasions and channels for peak thermal transfer.
An included application stencil and spreader take the guesswork out of applying XTM50 to your CPU cooler.
XTM50’s high-stability liquid compound lasts for years with no drying, cracking or change in consistency. Non-conductive and contains zero volatile compounds.